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Chomerics THERM-A-GAP 50TBL; The Next Generation of Thin Bond Line Thermal Interface Materials

We are pleased to introduce Parker Chomerics' latest addition to the THERM-A-GAP GEL thermal interface material family: THERM-A-GAP GEL 50TBL. This innovative product offers exceptional thermal conductivity and is designed to meet the demanding requirements of high-performance electronic applications.

THERM-A-GAP GEL 50TBL is a 5.0 W/m-K, fully cured, one component, thermal gel that was developed as an optimal solution for thin bond line applications and an improvement to the performance limitations of traditional materials such as greases and phase change materials. Download datasheet.

For more information on THERM-A-GAP 50TBL contact


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