From Heat to High Performance: Smarter Cooling with nVent SCHROFF Solutions

nVent SCHROFF'S advanced cooling portfolio will meet your cooling needs. By combining innovative air-to-liquid heat exchange, flexible cold plate technology, and targeted rack-level cooling, these solutions are designed to meet the evolving challenges of high-density applications. Whether it’s optimizing airflow, enabling rapid maintenance, or delivering precise temperature control at the component level, each approach plays a key role in creating a more resilient and efficient infrastructure.

4U Air-to-Liquid Cooling (LHX)

Higher heat density is a major concern when electronics in 19" applications are upgraded. Conventional methods of in-rack forced air or air conditioning may not be enough to protect vital electronics from over-heating with the rapid advancement of AI chips & GPUs.

Ruggedized to meet the requirements of naval and land-based defense applications, the MIL LHX is reliable, easy to install and retrofittable liquid-to-air cooling for 19"electronics cabinets.

Our COTS design allows for short lead time design, offering multiple levels of cooling performance allowing users to achieve higher computing density in new racks and existing applications.

Features

• Cooling capacity of 7.5 kW

• Plugs into existing chilled water system or facility water system

• Variable air flow of up to 1337.5 m3/h, 787.2 CFM

• Water flow temperature from 14°C to 25°C (w/o condensation)

• Ambient temperature from 5°C to 50°C

• Rack-integrated solutions reduce noise level

• Support variant Cooling Liquid

• Suitable for high shock & vibration environments

Interested in this product? Check out more details HERE

19" Rack Device Air Conditioner

nVent SCHROFF designed a 3U, 19" air conditioner unit to enhance the cooling capacity of Rack Mount Chassis by up to 1500 W. It is retrofittable and can be installed underneath the Rack Mount Chassis to cool the air inlet temperature of the chassis. The forced air-cooled Rack Mount Chassis will draw its inlet air through the low air impedance air path of the 19" Rack Device Air Conditioner.

Regardless of environmental temperature, the new 19" Rack Device Air Conditioner will cool down the air inlet temperature to the Rack Mount Chassis to values close above the condensation point to achieve the maximum DeltaT within the chassis. This air-to-air cooling device uses a cooling compressor to provide cold cooling liquid to the evaporator in the air flow cooling path. The heated liquid coming from the evaporator is cooled down to the room temperature at the condenser on the back side of the air conditioner, and the heat will be exhausted by the fans to the backside of the air conditioner.

Want more details on this great product coming soon? Click HERE

East Swap LFT - Liquid Flow Through Coldplate

The nVent SCHROFF Easy Swap LFT (Liquid Flow Through) solution is designed to efficiently cool high-power boards in standard 19” card cages where forced air cooling at ambient temperature is no longer sufficient - while preserving hot-swap capability and retrofit flexibility.

Key Benefits:

• High Cooling Capability - Liquid cooling at board level with cooling performance exceeding 200W per board

• Hybrid Cooling Architecture - High-power boards are liquid cooled, while lower-power boards remain air cooled within the same chassis

• Retrofit-Ready Design - Integrates inot existing 19" card cages with no special board design required

• Hot-Swap Capability Maintained - Boards can be inserted or removed without interruption of the cooling circuit

• Standalone Cooling System - Self-contained liquid cooling circuit with pump, fans, and heat exchanger.

Interested in this product coming soon? Check out more details HERE

Contact Sales@odonnell.com for more information!