Liquid Flow Through Modules: Next Level Cooling for Advanced Computing Power

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Although software is advancing rapidly, processors must remain the same size or shrink to meet SWaP requirements. As the upper threshold of board level heat and power dissipation continues to rise, it is exceeding the limits of air and conduction cooling, requiring more advanced solutions to keep boards from overheating. 

nVent SCHROFF has developed a Liquid Flow Through cooling solution in accordance with VITA Standard 48.4 which will allow customers to solve their thermal challenges with a customized flow through path that transfers heat away from processors. 

This provides superior heat dissipation compared to air or conduction cooling, with cooling capacity of approximately 300+ watts per 6U slot.

Questions? We've got answers!

How does nVent SCHROFF ensure liquid/coolant does not come into direct contact with electronics?

nVent SCHROFF designed the Liquid Flow Through Module using VITA 48.4 and SOSA technical standards. The module is welded into MIL standard plating, creating a no leak barrier between the liquid and electronics. Quick disconnects securely connect to any VITA 48.4 chassis with our 311 Series inserters/extractors, providing positive pressure on the connectors, with further security coming from high clamp force Card-Loks to lock the board within the chassis.

Can nVent SCHROFF design custom 3U and 6U modules?

Yes, our engineering team can create the most optimal flow path using in-house thermal simulations to meet that unique printed circuit board design. The 3U module can cool up to 150W per slot and 6U module can cool up to 300W per slot.

Can nVent SCHROFF provide the required board retainers and inserters/extractors?

Yes, in addition to providing a custom flow path module, nVent SCHROFF can recommend the right Card-Lok and Inserter/Extractor to meet the requirements. In most cases, a high clamp force (HC) series Card-Lok and a HF311 Series inserter/extractor will be recommended.

How does liquid get into the Liquid Flow Through Module?

Liquid coolant is supplied to the PCB modules via leak-proof quick disconnects located inside the VITA 48.4 compliant chassis. Coolant is supplied to the chassis from the external coolant source.

Have additional questions? Reach out to us - sales@odonnell.com

nVent SCHROFF LAUNCHES POSITIVE RETRACTION CARD-LOK

nVent announced the release of the Positive Retraction Card-Lok, used in rugged environments when a printed circuit board (PCB) must be reliably removed from a chassis in the field.

The positive retraction mechanism allows the Card-Lok to disengage from the wall of the chassis by eliminating the stiction.  The Card-Lok is then able to retract, and the PCB can be removed from the Chassis, allowing access to vital electronics.

These standard COTS or modifiable versions are drop-in replacements of the nVent SCHROFF 260, 265, and 280 Calmark & Birtcher lines. In addition, these Positive Retraction Card-Loks provide better clamp force and thermal management than their standard Card-Lok series equivalents. 

Designed and manufactured in an AS9100 certified factory in San Diego, California, the Positive Retraction Card-Lok meets VITA (46, 48.2, 48.4, 48.5 and 48.8) and SOSA standards along with being DFARS, JOSCAR, and ITAR compliant.  Also meeting advance requirements for shock and vibration resistance.

The nVent SCHROFF’s Positive Retraction Card-Lok recently won the prestigious Best in Show Award by Embedded Computing Design at Electronica 2024 Exhibition and Conference. 

Contact our highly specialized engineering team at sales@odonnell.com for more information.

Copy of Introducing nVent SCHROFF'S hARDWARE-IN-THE-LOOP

nVent SCHROFF is proud to launch its latest initiative designed to power the future of real-time testing and simulation.​

HiL testing is mission-critical to verify final product quality in industries like automotive, aerospace, and semiconductor. Engineers invest in state-of-the-art HiL systems to simulate real-world conditions, but without robust infrastructure, these systems are vulnerable to inefficiencies, integration challenges, and safety risks.

nVent SCHROFF provides industry-proven enclosures, modular chassis, and power solutions that seamlessly connect and protect HiL test solutions. Our collaborative approach ensures tailored systems that optimize space, enhance thermal management, and support long-term scalability.

Download the HiL whitepaper Here

Contact us for further information - sales@odonnell.com